www.virginiasemi.com , firstname.lastname@example.org A. Introduction
In this paper some very general properties for silicon and several types of Corning glass are given. Many silicon wafer-users bond silicon to glass, or use glass materials in coordination with silicon. The glass data reported here has been taken from the Corning web site  and assumed to be accurate. Most the data on silicon can be located by reviewing a variety of textbooks, or the primary source given in reference 2.
This Tech-note is intended to assist general silicon users with a quick reference to very basic glass properties and suppliers, and the reader should carefully review the Corning web site and other references as needed and appropriate.
Secondary Flat Orientation and Location: SEMI Specification
Center Thickness: 1000um +/- 25um, 500um +/- 25um standard
Total Thickness Variation (5 point measurement): <20um
Surface Polishing and Properties: Single Side or Double Side Polished
Density: 2.13 g/cm3
Youngs Modulus: 5.2e3 Kg/mm2
Poisson’s ratio: 0.22
Coefficient Thermal Expansion: 3.2 e-6 1/C
Working Point: 1068 C
Annealing Point: 496 C
Dielectric Constant: 4.1 @ 1MHz
Loss Tangent: 0.06% @ 1MHz
Index of refraction: 1.47
A basic listing of the properties of silicon is given below. The reader should further review the VSI Technology Library (www.virginiasemi.com) for extensive details regarding silicon parameters, specifications, and characteristics.
CZ and FZ Silicon Substrates
The basic specifications for VSI CZ and FZ silicon wafers are given below.