Digital Systems Senior Design Project



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* Resubmissions are due within one week of the date of return, and will be awarded a score of “6” provided all report requirements have been met at a nominal level.
Comments:

Comments from the grader will be inserted here.

  1. Introduction

VIPER is a virtual/augmented reality system. It will track a user’s head location and orientation and display an image based on that data. As the user walks around the table top environment there head will move which in turn moves the corresponding virtual camera changing the user’s perspective of the virtual environment. Tracking a user’s head location requires the use of filters to clean up noisy signals. For VIPER it was decided to use a Kalman filter. This requires data to be collected from an accelerometer, gyroscope, magnetometer, camera, and ultrasonic system. Since the primary goal of this project is to allow the user to experience a virtual environment, the head tracking system needs to accumulate as little error as possible. So the primary constraint for this project is on the data collection and Kalman filter implementation. The second guiding constraint is to make the package as portable as possible. We intend to have three separate packages: a head unit, a beacon unit, and our Beagleboard will have its own separate package. At the moment our plan is to package the head unit in a small box and mount it on a hat the user can wear along with the glasses. The beacon unit will be in a smaller box and placed on a table. The Beagleboard will be in a box similar in size to the head unit and attached to the users hip.

  1. Commercial Product Packaging

    1. Product #1

The first commercial product is the Vuzix STAR 1200 Augmented Reality System. As the illustration indicates, the package includes a pair of glasses with transparent/translucent lenses and a front mounted camera device. At first, our package was going to be similar in that we were going to mount the head unit with the camera on the glasses. However that is not the case anymore and will be further explained in the packaging specifications section. Some of the positive aspects of this product’s packaging include: lightweight, stylish, onboard calibration. Some of the negative aspects include: limited degrees of freedom, clunky or uncomfortable. To sum things up our projects packaging will be similar to this one more in concept than actual design.



    1. Product #2

The second commercial product is the Vuzix Wrap 1200VR Virtual Reality System. The package includes its own head tracking system as shown in the illustration below. The glasses we plan to use for our project are very similar if not the same as these glasses. Some of the positive aspects of this product’s packaging include: compact design, style, comfortable. Some of the negative aspects include: fragile frame, size limiting shape. In the end, the things our project shares with this is mainly the styling of the glasses since our tracking system won’t be nearly as small as the one shown.



  1. Project Packaging Specifications

Our project will come in three basic packages. The head unit will contain the sensors (accelerometer, gyroscope, compass), IR camera, microcontrollers, ultrasonic receiver, and Xbee module (receiver). The beacon unit will contain the IR LED, a microcontroller, an ultrasonic emitter, and the other Xbee module (transmitter). The Beagleboard will be in its own self-contained package. The head unit will most likely be mounted to a hat or some other headgear. A USB cable will connect the head unit to the Beagleboard, which will be strapped to the users hip or midsection. The beacon unit will sit on a table top at most 2 meters from the user.



  1. PCB Footprint Layout

Part

Pins

Package

Dimensions

AT91SAM9XE256


208 pins

QFP

31.2mmx31.2mm

PIC24FJ6GA002


28pins

SSOP

8.20mmx10.5mm

PIC32MX534F06H


64 pins

TQFP

12mmx12mm

40TR12B-R


N/A

N/A

7.62mm height by 11 mm diameter

TCM8230MD


N/A

N/A

6mmx6mmx4.5mm

WRL-08664

N/A

N/A

24.38mmx32.94mmx8.12mm

ITG-3200

N/A

QFN(chip)

4mmx4mmx0.9mm;17.78mmx13.97(breakout)


MMA8452Q

N/A

QFN(chip);

3mmx3mmx1mm;17.78mmx13.97(breakout)


MAG3110

N/A

N/A

13.3mmx14.5mm(breakout)

296-25798-ND

N/A

N/A

82.55mmx82.55mm

Estimated head unit dimensions: 90mmx90mm

Estimated beacon unit dimensions:55mmx55mm


  1. Summary

This report describes how we plan to package and house our PCB’s as well as how we want to use those different packages. As stated before there are three packages: head unit, beacon unit, and Beagleboard. Our project is somewhat similar to commercial products, but overall is fairly unique.

List of References



[1]

Texas Instruments, "CMOS Hex Converter/Buffers datasheet," August 1998. [Online]. Available: http://www.ti.com/lit/ds/symlink/cd4049ub.pdf. [Accessed 2012].

[2]

Vuzix, Inc., "Wrap 1200VR Brochure," 2012. [Online]. Available: http://www.vuzix.com/site/_photo/sheet/Wrap1200_Brochure_006PB0014-A_%28B-lores%29.pdf. [Accessed 2012].

[3]

Microchip, "PIC24FJ64GA004 Family," 2010. [Online]. Available: http://ww1.microchip.com/downloads/en/DeviceDoc/39881D.pdf. [Accessed 2012].

[4]

Jameco, "Ultrasonic Sensor Pair Datasheet," [Online]. Available: http://www.jameco.com/Jameco/Products/ProdDS/139492.pdf. [Accessed 2012].

Appendix A: Project Packaging Illustrations

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